Shenzhen ZZH Electronics CO.,Ltd -

Shenzhen ZZH Electronics CO.,Ltd

Showing 1 - 5 of 5, total 1 pages [First] [Previous] [Next] [Last]

via in pad pcb
Specification: Vias in pad(filled with non-conductive epoxy)
Detail: Layer count: 10 layers Material: Fr4 Tg170 Board Thickness: 1.5mm Surface Finished: Immersion Gold Vias in pad(filled with non-conductive epoxy)

high frequency pcb
Specification: Material: Rogers 4350B + Fr4 tg170
Detail: High Frequency PCB Layer count: 8 layers Material: Rogers 4350B + Fr4 tg170 Blind via: L1-L2, L1-L3, L6-L8, L7-L8 Edge plating IPC Class 3 standard on the entire board

rigid-flex pcb
Specification: Material: Rigid-Flex board(PI + Fr4)
Detail: Layer Count: 2 layers Material: Rigid-Flex board(PI + Fr4) Board Thickness: 1.0mm Surface Finished: Immersion Gold

probe card pcb
Specification: Layer count: 7 layers PCB
Detail: Layer count: 7 layers Material: Fr4 Tg170 Board Thickness: 5.0mm Surface Finished: Immersion Gold Solder mask: Black

pcb with gold finger
Specification: Layer Count: 4 layers
Detail: Layer Count: 4 layers Material: Fr4 Tg170 Board Thickness: 1.6mm Surface finished: Immersion Gold + Gold finger(50u") Solder Mask: Blue


Showing 1 - 5 of 5, total 1 pages [First] [Previous] [Next] [Last]
1